𝔖 Bobbio Scriptorium

✦ LIBER ✦

The use environments of electronic assemblies and their impact on surface mount solder attachment reliability : Werner Engelmaier. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 903 (1990)

Publisher: Elsevier Science
Year: 1991
Tongue: English
Weight: 120 KB
Volume: 31
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(91)90123-o

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Surface-mount attachment reliability of

Surface-mount attachment reliability of clip-leaded ceramic chip carriers on FR-4 circuit boards : Werner Engelmaier and Abbas I. Attarwala. IEEE Trans. Compon. Hybrids mfg Technol.12(2), 284 (1989)

📂 Article 📅 1990 🏛 Elsevier Science 🌐 English ⚖ 137 KB

The impact of packaging on the reliabili

The impact of packaging on the reliability of flip-chip solder bonded devices : Kevin J. Lodge and David J. Pedder. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 847 (1990)

📂 Article 📅 1991 🏛 Elsevier Science 🌐 English ⚖ 128 KB