✦ LIBER ✦
Creep fatigue modeling for solder joint reliability predictions including the microstructural evolution of the solder : Harold J. Frost and Robert T. Howard. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 727 (1990)
- Publisher
- Elsevier Science
- Year
- 1991
- Tongue
- English
- Weight
- 133 KB
- Volume
- 31
- Category
- Article
- ISSN
- 0026-2714
No coin nor oath required. For personal study only.