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The effect of scaling on contact and interconnect properties with sputtered TiSi2 metallization

✍ Scribed by RK Nahar; PD Vyas

Publisher: Elsevier Science
Year: 1993
Tongue: English
Weight: 532 KB
Volume: 44
Category: Article
ISSN: 0042-207X
DOI: 10.1016/0042-207x(93)90354-d

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