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The Effect of Mixed Abrasive Slurry on CMP of 6H-SiC Substrate

✍ Scribed by Lee, Ho Jun; Park, Boum Young; Lee, Hyun Seop; Jeong, Suk Hoon; Seo, Heon Deok; Joo, Suk Bae; Jeong, Hae Do; Kim, Hyoung Jae

Book ID
120658857
Publisher
Trans Tech Publications, Ltd.
Year
2008
Tongue
English
Weight
388 KB
Volume
569
Category
Article
ISSN
1662-9752

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