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The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperatures

✍ Scribed by Limeng Yin, Song Wei, Zhangliang Xu…

Book ID
120681377
Publisher
Springer US
Year
2012
Tongue
English
Weight
502 KB
Volume
24
Category
Article
ISSN
0957-4522

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✍ Subramanian, K. N. 📂 Article 📅 2012 🏛 John Wiley & Sons, Ltd 🌐 English ⚖ 633 KB

Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to al