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Erratum to: The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperatures

✍ Scribed by Limeng Yin, Song Wei, Zhangliang Xu…

Book ID: 120681671
Publisher: Springer US
Year: 2013
Tongue: English
Weight: 112 KB
Volume: 24
Category: Article
ISSN: 0957-4522
DOI: 10.1007/s10854-013-1341-9

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