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The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn–8.55Zn–0.5Ag–0.1Al–xGa solders and Cu

✍ Scribed by Nai-Shuo Liu; Kwang-Lung Lin


Book ID
113895766
Publisher
Elsevier Science
Year
2006
Tongue
English
Weight
422 KB
Volume
54
Category
Article
ISSN
1359-6462

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