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The effect of Cu interlayers on grain size and stress in sputtered Fe–Cu multilayered thin films

✍ Scribed by N.R. Shamsutdinov; A.J. Böttger; F.D. Tichelaar

Book ID
113896056
Publisher
Elsevier Science
Year
2006
Tongue
English
Weight
286 KB
Volume
54
Category
Article
ISSN
1359-6462

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✍ P. J. Silvėrman; C. V. Briscoe 📂 Article 📅 1978 🏛 Springer US 🌐 English ⚖ 295 KB

Pure Cu and Cu(Fe) thin films containing ~0.1 and ~1.0 at % Fe were prepared by low-temperature deposition onto a liquid-helium-cooled substrate. The Cu (Fe ) films were annealed sequentially at approximately 17, 70, and 270 K. After each annealing stage the resistivity was measured down to ~l.5 K.