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The adhesion of copper films deposited onto aluminum nitride

✍ Scribed by J.-W. Park; A. J. Pedraza; D. H. Lowndes

Book ID: 111534969
Publisher: Springer
Year: 1999
Tongue: English
Weight: 715 KB
Volume: 34
Category: Article
ISSN: 0022-2461
DOI: 10.1023/a:1004544200291

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