Testing for adhesion of hybrid films : L. Jacobson. Proc. 21st Electronic Components Conf., Washington D.C., U.S.A., 10–12 May (1971), p. 474

• Publisher: Elsevier Science
• Year: 1971
• Tongue: English
• Weight: 110 KB
• Volume: 10
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(71)90089-8