𝔖 Bobbio Scriptorium

✦ LIBER ✦

Bonded crossovers for thin film circuits : J. A. Burns. Proc. 21st Electronic Components Conf., Washington D.C., U.S.A. 10–12 May (1971), p. 310

Publisher: Elsevier Science
Year: 1971
Tongue: English
Weight: 110 KB
Volume: 10
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(71)90085-0

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Thin film laser machining : M. W. Bodnar

Thin film laser machining : M. W. Bodnar. Proc. 21st Electronic Components Conf., Washington D.C., U.S.A., 10–12 May (1971), p. 74

📂 Article 📅 1971 🏛 Elsevier Science 🌐 English ⚖ 109 KB

A hybrid thin-film radiosonde transmitte

A hybrid thin-film radiosonde transmitter : R. E. Askew. Proc. 21st Electronic Components Conf., Washington D.C., U.S.A., 10–12 May (1971), p. 408

📂 Article 📅 1971 🏛 Elsevier Science 🌐 English ⚖ 97 KB

Testing for adhesion of hybrid films : L

Testing for adhesion of hybrid films : L. Jacobson. Proc. 21st Electronic Components Conf., Washington D.C., U.S.A., 10–12 May (1971), p. 474

📂 Article 📅 1971 🏛 Elsevier Science 🌐 English ⚖ 110 KB

Testing integrated circuits with a laser

Testing integrated circuits with a laser beam : R. E. McMahon. Proc. 21st Electronic Components Conf., Washington D.C., U.S.A., 10–12 May (1971), p. 412

📂 Article 📅 1971 🏛 Elsevier Science 🌐 English ⚖ 109 KB

Flip-chip solder terminals : P. A. Totta

Flip-chip solder terminals : P. A. Totta. Proc. 21st Electron. Compon. Conf., Washington D.C., U.S.A., 10–12 May (1971), p. 275

📂 Article 📅 1972 🏛 Elsevier Science 🌐 English ⚖ 108 KB

Precision adjusted, beam-leaded, thin fi

Precision adjusted, beam-leaded, thin film resistors : M. Tierman and W. Wesolowski. Proc. 21st Electronic Components Conf., Washington D.C., U.S.A., 10–12 May (1971), p. 32

📂 Article 📅 1971 🏛 Elsevier Science 🌐 English ⚖ 110 KB