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Temperature cycling effects between Sn/Pb solder and thick film Pd/Ag conductor metallization

โœ Scribed by Bi-Shiou Chiou; Liu, K.C.; Jeng-Gang Duh; Palanisamy, P.S.

Book ID
114560554
Publisher
IEEE
Year
1991
Tongue
English
Weight
592 KB
Volume
14
Category
Article
ISSN
0148-6411

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๐Ÿ“œ SIMILAR VOLUMES

Temperature cycling effects between Sn/P
Temperature cycling effects between Sn/Pb solder and electroless copper plated AIN substrate
โœ Bi-Shiou Chiou; Jiann-Haur Chang; Jenq-Gong Duh ๐Ÿ“‚ Article ๐Ÿ“… 1995 ๐Ÿ› Springer US ๐ŸŒ English โš– 380 KB

Thermal cycling effects on Sn/Pb solder and electroless Cu-plated AIN substrates are investigated. X-ray diffraction patterns reveal the existence of Cu20 for the electroless Cu-plated AIN after thermal cycling in an environmental chamber. Moisture in the chamber results in the oxidation of electrol