✦ LIBER ✦

TEM microstructural analysis of As-Bonded Al–Au wire-bonds

✍ Scribed by Adi Karpel; Giyora Gur; Ziv Atzmon; Wayne D. Kaplan

Book ID: 106393047
Publisher: Springer
Year: 2007
Tongue: English
Weight: 575 KB
Volume: 42
Category: Article
ISSN: 0022-2461
DOI: 10.1007/s10853-007-1592-z

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Microstructural characteristics of Au/Al

Microstructural characteristics of Au/Al bonded interfaces

✍ Jun-hui Li; Lei Han; Ji-an Duan; Jue Zhong 📂 Article 📅 2007 🏛 Elsevier Science 🌐 English ⚖ 747 KB

Microstructure evolution of Al-1% Si bon

Microstructure evolution of Al-1% Si bonding wire for microelectronic reliability

✍ Hyung-Giun Kim; Dae-Hyung Cho; Eun-Kyun Jeong; Won-Yong Kim; Sung-Hwan Lim 📂 Article 📅 2009 🏛 The Korean Institute of Metals and Materials 🌐 English ⚖ 898 KB

Microstructure and mechanical properties

Microstructure and mechanical properties of annealed Al-1%Si bonding wire

✍ Yanqing Liu; W. Kinzy Jones 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 690 KB

Mechanical reliability of Au and Cu wire

Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads

✍ Petar Ratchev; Serguei Stoukatch; Bart Swinnen 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 663 KB

Detailed investigation of ultrasonic Al–

Detailed investigation of ultrasonic Al–Cu wire-bonds: II. Microstructural evolution during annealing

✍ M. Drozdov; G. Gur; Z. Atzmon; W. D. Kaplan 📂 Article 📅 2008 🏛 Springer 🌐 English ⚖ 623 KB

Effects of Cu and Pd addition on Au bond

Effects of Cu and Pd addition on Au bonding wire/Al pad interfacial reactions and bond reliability

✍ Sang-Ah Gam; Hyoung-Joon Kim; Jong-Soo Cho; Yong-Jin Park; Jeong-Tak Moon; Kyung 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 571 KB