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Microstructure evolution of Al-1% Si bonding wire for microelectronic reliability

✍ Scribed by Hyung-Giun Kim; Dae-Hyung Cho; Eun-Kyun Jeong; Won-Yong Kim; Sung-Hwan Lim

Book ID
111857034
Publisher
The Korean Institute of Metals and Materials
Year
2009
Tongue
English
Weight
898 KB
Volume
5
Category
Article
ISSN
1738-8090

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