Detailed investigation of ultrasonic Al–Cu wire-bonds: II. Microstructural evolution during annealing

✍ Scribed by M. Drozdov; G. Gur; Z. Atzmon; W. D. Kaplan

• Publisher: Springer
• Year: 2008
• Tongue: English
• Weight: 623 KB
• Volume: 43
• Category: Article
• ISSN: 0022-2461
• DOI: 10.1007/s10853-008-2955-9