Substrate Dissolution and Shear Properties of the Joints between Bi-Ag Alloys and Cu Substrates for High-Temperature Soldering Applications

✍ Scribed by Jenn-Ming Song; Hsin-Yi Chuang; Zong-Mou Wu

• Book ID: 107454962
• Publisher: Springer US
• Year: 2007
• Tongue: English
• Weight: 728 KB
• Volume: 36
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-007-0222-5