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Substrate constraint and adhesive thickness effects on fracture toughness of adhesive joints

✍ Scribed by Duan, Kai; Hu, Xiaozhi; Mai, Yiu-Wing

Book ID
115488659
Publisher
Taylor and Francis Group
Year
2004
Tongue
English
Weight
291 KB
Volume
18
Category
Article
ISSN
0169-4243

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Abstraet--A Compact Mixed Mode (CMM) fracture specimen was developed for fracture toughness determination. It is capable of determining the complete range of fracture toughness under pure mode I, pure mode II and mixed mode I and II loading conditions. Finite element analysis was conducted to provid

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Adhesive strength shows temperature and rate dependencies that reflect viscoelastic properties of an adhesive. Similarly, a critical strain energy release rate is expected to show temperature and rate dependencies because deformation and fracture of the adhesive occur at the time of the measurement