Adhesive strength shows temperature and rate dependencies that reflect viscoelastic properties of an adhesive. Similarly, a critical strain energy release rate is expected to show temperature and rate dependencies because deformation and fracture of the adhesive occur at the time of the measurement
Mixed mode fracture analysis and toughness of adhesive joints
β Scribed by H.L.J. Pang
- Publisher
- Elsevier Science
- Year
- 1995
- Tongue
- English
- Weight
- 407 KB
- Volume
- 51
- Category
- Article
- ISSN
- 0013-7944
No coin nor oath required. For personal study only.
β¦ Synopsis
Abstraet--A Compact Mixed Mode (CMM) fracture specimen was developed for fracture toughness determination. It is capable of determining the complete range of fracture toughness under pure mode I, pure mode II and mixed mode I and II loading conditions. Finite element analysis was conducted to provide calibration factors for the stress intensity factor solution for the Compact Mixed Mode (CMM) specimen. The finite element result, provided empirical correction factors fll for the pure mode I case and flix for the pure mode II case which intrinsically take account of the substrate-to-adhesive mechanical properties of the test specimen. A range of pure mode I, pure mode II and combinations of mode I and II fracture load cases were investigated using the Compact Mixed Mode (CMM) fracture specimen. With the test results, a failure assessment diagram for mixed mode fracture toughness was proposed and compared to theoretical concepts of mixed mode fracture criteria.
π SIMILAR VOLUMES
The fracture toughness of an epoxy-based film adhesive has been investigated using Mode I and combined Mode 1 + Mode II loadings. The opening Mode, Mode I, was realized by employing the Tapered Double Cantilever Beam (TDCB) specimen, while the mixed opening and shear modes, Mode I + Mode II, resulte
The fatigue resistance of a single-lap aluminium adhesive joint to cyclic loading in combined shear and bending mode is investigated by nonlinear finite element analysis and crack propagation experiments. The epoxy adhesive is modelled by an elasto-plastic overlay material model. The initial cycles