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Study on the Effects of Copper Oxide Growth on the Peel Strength of Copper/Polyimide

✍ Scribed by H.J. Lee; Jin Yu

Book ID
107455051
Publisher
Springer US
Year
2008
Tongue
English
Weight
813 KB
Volume
37
Category
Article
ISSN
0361-5235

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πŸ“œ SIMILAR VOLUMES

Effects of temperature/humidity treatmen
Effects of temperature/humidity treatments on the peel strength of CuCr alloy films on polyimide
✍ E. C. Ahn; Jin Yu; I. S. Park πŸ“‚ Article πŸ“… 1996 πŸ› Springer US 🌐 English βš– 846 KB

A single layer of CuCr alloy was sputter deposited on polyimide films instead of Cu/Cr double layers. The adhesion strengths of the metal/polyimide thin films were measured by the peel test. In order to study the effects of temperature and humidity on the adhesion strength, 85 ~ R.H. (T/H) treatment