Effects of temperature/humidity treatments on the peel strength of CuCr alloy films on polyimide

✍ Scribed by E. C. Ahn; Jin Yu; I. S. Park

• Publisher: Springer US
• Year: 1996
• Tongue: English
• Weight: 846 KB
• Volume: 7
• Category: Article
• ISSN: 0957-4522
• DOI: 10.1007/bf00133111

✦ Synopsis

A single layer of CuCr alloy was sputter deposited on polyimide films instead of Cu/Cr double layers. The adhesion strengths of the metal/polyimide thin films were measured by the peel test. In order to study the effects of temperature and humidity on the adhesion strength, 85 ~ R.H. (T/H) treatments were applied to the specimens. Results showed that the peel strength without T/H treatments increased proportionally with the Cr content in the CuCr alloy layer(x) up to 17 at%, and then saturated. Among the samples studied, the peel strength decreased with hold time under T/H conditions for all the cases, but most drastically for the sample with x=8.5. The very poor peel strength of that sample (x=8.5) was attributed to the occurrence of interfacial failures, which were thought to take place along CuCr oxide/polyimide interfaces.