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Effects of polyimide chemical structure and environment on the diffusivity of copper

โœ Scribed by Peter F. Green; Larry L. Berger

Publisher
Elsevier Science
Year
1993
Tongue
English
Weight
574 KB
Volume
224
Category
Article
ISSN
0040-6090

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## Abstract Polymerโ€clay nanocomposites are wellโ€known highโ€performance materials with a superior tensile modulus. However, in the case of composites with polyimide (PI), additional functions require study because PI is a highโ€performance material in itself. Significant enhancement of thermal condu