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Study of electroplated copper thin film and its interfacial reactions in the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure

โœ Scribed by Khin Maung Latt; Kangsoo Lee; Y. K. Lee


Book ID
110295852
Publisher
Springer
Year
2001
Tongue
English
Weight
776 KB
Volume
20
Category
Article
ISSN
0261-8028

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