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Comparative study of copper films prepared by ionized metal plasma sputtering and chemical vapor deposition in the Cu/TaN/SiO2/Si multilayer structure

✍ Scribed by Khin Maung Latt; C. Sher-Yi; T. Osipowicz; K. Lee; Y. K. Lee


Book ID
110314595
Publisher
Springer
Year
2001
Tongue
English
Weight
310 KB
Volume
36
Category
Article
ISSN
0022-2461

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