Study on electroplated copper thin film and its interfacial reactions in the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure

✍ Scribed by Khin Maung Latt; Y. K. Lee; J. A. Van Kan; A. A. Mahabai

• Book ID: 110313219
• Publisher: Springer
• Year: 2001
• Tongue: English
• Weight: 258 KB
• Volume: 36
• Category: Article
• ISSN: 0022-2461
• DOI: 10.1023/a:1012441900620