Curing kinetics and mechanism of bisphen
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Shigang Shen; Yanfang Li; Jungang Gao; Hanwen Sun
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Article
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2001
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John Wiley and Sons
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English
⚖ 141 KB
## Abstract The kinetics of the cure reaction for systems of bisphenol‐S epoxy resin with 4,4′‐diaminodiphenyl ether or phthalic anhydride as a curing agent were investigated with a differential scanning calorimetry. Autocatalytic behavior was shown in the first stages of the cure for the systems,