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Curing kinetics and mechanism of bisphenol S epoxy resin with 4,4′-Diaminodiphenyl ether or phathlic anhydride

✍ Scribed by Shigang Shen; Yanfang Li; Jungang Gao; Hanwen Sun

Publisher
John Wiley and Sons
Year
2001
Tongue
English
Weight
141 KB
Volume
33
Category
Article
ISSN
0538-8066

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✦ Synopsis

Abstract

The kinetics of the cure reaction for systems of bisphenol‐S epoxy resin with 4,4′‐diaminodiphenyl ether or phthalic anhydride as a curing agent were investigated with a differential scanning calorimetry. Autocatalytic behavior was shown in the first stages of the cure for the systems, which could be well described by the model proposed by Kamal [Polym Eng Sci 1973, 13, 59–64] that includes two rate constants k~1~ and k~2~ and two reaction orders, m and n. k~1~ and k~2~ values are observed to increase with the increasing temperature. With the proceeding of the cure reaction, the cross‐linking structure appears, and the reaction is mainly controlled by diffusion in the latter stages. The molecular mechanism of the curing system was discussed. © 2001 John Wiley & Sons, Inc. Int J Chem Kinet 33: 558–563, 2001

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