Studies on mechanical properties of polymer composites by X-ray diffraction. I. Residual stress in epoxy resin by X-ray diffraction

✍ Scribed by Katsuhiko Nakamae; Takashi Nishino; Xu Airu; Takeshi Matsumoto; Tomoharu Miyamoto

• Publisher: John Wiley and Sons
• Year: 1990
• Tongue: English
• Weight: 404 KB
• Volume: 40
• Category: Article
• ISSN: 0021-8995
• DOI: 10.1002/app.1990.070401133

✦ Synopsis

Residual stress in epoxy resin cured on A1 plate was investigated by X-ray diffraction. Microdeformation of A1 crystal can be detected as a shift of X-ray diffraction peak induced by the stress resided. Results show that A1 plate is subjected to a uniaxial compressive stress of 29 MPa parallel to the adherend surface. In contrast to this, epoxy resin side (embedded particles) was found to be subjected to a uniaxial tensile stress. Experimental data have been compared with the calculated data and that obtained by the bimetallic method. On the basis of results, it is reasonable to conclude that Tg is a key factor determining the residual stress, and the difference of thermal expansion coefficients between A1 plate and the cured epoxy resin from Tg to room temperature causes the residual stress. It has been shown that the X-ray diffraction method is useful to detect the stress a t the interface between resin and adherend in situ and nondestructively.