Residual stress in particulate epoxy resin by X-ray diffraction

✍ Scribed by Takashi Nishino; Xu Airu; Takeshi Matsumoto; Kanki Matsumoto; Katsuhiko Nakamae

• Publisher: John Wiley and Sons
• Year: 1992
• Tongue: English
• Weight: 463 KB
• Volume: 45
• Category: Article
• ISSN: 0021-8995
• DOI: 10.1002/app.1992.070450713

✦ Synopsis

Residual stress in particulate epoxy resin was investigated by X-ray diffraction. Microdeformation of incorporated A1 and a-Si02 crystal, which was induced by the residual stress, could be detected as a shift of X-ray diffraction peak. The residual stress at the interface between the adherend and the particulate epoxy resin was found to decrease with the increase of volume fraction of filler. It was shown that the difference in the thermal expansion coefficients between the adherend and the particulate epoxy resin is much more effective on residual stress than the increment of Young's modulus owing to the incorporation of filler. When epoxy resin was cured on the A1 plate, incorporated particles were subjected to a tensile stress; while cured on polytetrafluoroethylene sheet, particles were subjected to a compressive stress. The incorporation of some inorganic particles is considered effective to reduce the residual stress.