✦ LIBER ✦

Structure and Bond Strength of a Copper–Alumina Interface

✍ Scribed by Yuichi Yoshino; Takashi Shibata

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Interface Structure and Bond Strength of

✍ Yuichi Yoshino; Hidehiko Ohtsu 📂 Article 📅 1991 🏛 John Wiley and Sons 🌐 English ⚖ 907 KB

Effect of interfacial bond strength on t

✍ Y.Z. Wan 📂 Article 📅 2002 🏛 Elsevier Science 🌐 English ⚖ 176 KB

Bonding at copper–alumina interfaces est

✍ C. Scheu; M. Gao; S. H. Oh; G. Dehm; S. Klein; A. P. Tomsia; M. Rühle 📂 Article 📅 2006 🏛 Springer 🌐 English ⚖ 331 KB

Effect of rolling temperature on interfa

✍ X. K. Peng; G. Heness; W. Y. Yeung 📂 Article 📅 1999 🏛 Springer 🌐 English ⚖ 520 KB

Bond strength between C3A paste and iron

✍ Chuichi Tashiro; Kenzo Ueoka 📂 Article 📅 1981 🏛 Elsevier Science 🌐 English ⚖ 490 KB

Fatigue strength testing of LTCC and alu

✍ A. Dąbrowski, P. Matkowski, L. Golonka 📂 Article 📅 2012 🏛 De Gruyter Open Sp. z o.o. 🌐 English ⚖ 865 KB