✦ LIBER ✦
Bonding at copper–alumina interfaces established by different surface treatments: a critical review
✍ Scribed by C. Scheu; M. Gao; S. H. Oh; G. Dehm; S. Klein; A. P. Tomsia; M. Rühle
- Book ID
- 106391322
- Publisher
- Springer
- Year
- 2006
- Tongue
- English
- Weight
- 331 KB
- Volume
- 41
- Category
- Article
- ISSN
- 0022-2461
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