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Effect of rolling temperature on interface and bond strength development of roll bonded copper/aluminium metal laminates

✍ Scribed by X. K. Peng; G. Heness; W. Y. Yeung


Book ID
111534741
Publisher
Springer
Year
1999
Tongue
English
Weight
520 KB
Volume
34
Category
Article
ISSN
0022-2461

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