## Abstract Thin films of about 1μm Titanium Aluminum Nitride (TiAlN) were deposited onto mild steel substrates by reactive direct current (DC) magnetron sputtering using a target consisting of equal segments of titanium and aluminum. X‐ray diffraction (XRD) analysis showed that the TiAlN phase had
Structural, electrical and mechanical characterization of magnetron-sputtered V–Ge–C thin films
✍ Scribed by O. Wilhelmsson; P. Eklund; H. Högberg; L. Hultman; U. Jansson
- Publisher
- Elsevier Science
- Year
- 2008
- Tongue
- English
- Weight
- 793 KB
- Volume
- 56
- Category
- Article
- ISSN
- 1359-6454
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✦ Synopsis
V 2 GeC MAX-phase thin films were deposited by DC magnetron sputter epitaxy in the temperature range 450-850 °C. The MAX-phase nucleates directly on (0 0 0 l)-oriented sapphire-wafer substrates without the need for a seed layer. The films contain, however, a small fraction of binary vanadium carbide (VC x ) inclusions. X-ray diffraction analysis furthermore shows that these inclusions partly consist of the ordered superstructure V 8 C 7 . The amount of Ge in the films decreases at higher temperatures, which can be attributed to Ge evaporation. At temperatures below 450 °C the films consist of polycrystalline Ge and an X-ray amorphous carbide phase attributed to VC x or V 2 C. No MAX-phase was observed in this temperature region. The electrical and mechanical properties of the films were characterized.
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Titanium dioxide films have been deposited using DC magnetron sputtering technique onto well-cleaned p-silicon substrates at an oxygen partial pressure of 7 Â 10 -5 mbar and at a sputtering pressure (Ar+O 2 ) of 1 Â 10 -3 mbar. The deposited films were calcinated at 673 and 773 K. The composition of