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Stresses in sputter-deposited nickel and copper oxide thin films

✍ Scribed by P.V. Plunkett; R.M. Johnson; C.D. Wiseman

Publisher
Elsevier Science
Year
1979
Tongue
English
Weight
437 KB
Volume
64
Category
Article
ISSN
0040-6090

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## Abstract The influence of the electrochemical potential and deposition mode on the preferred orientation, morphology and microstructure of crystallites in electrochemically deposited (ECD) copper thin films was investigated using X‐ray diffraction (XRD), scanning electron microscopy (SEM) and th