𝔖 Bobbio Scriptorium
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Stresses in Adhesively Bonded Bi-Material Assemblies Used in Electronic Packaging

✍ Scribed by Suhir, E.

Book ID
111864708
Publisher
Cambridge University Press
Year
1986
Weight
309 KB
Volume
72
Category
Article
ISSN
0272-9172

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πŸ“œ SIMILAR VOLUMES

Adhesively bonded assemblies with identi
Adhesively bonded assemblies with identical nondeformable adherends and β€˜piecewise continuous’ adhesive layer: predicted thermal stresses in the adhesive
✍ E Suhir πŸ“‚ Article πŸ“… 2000 πŸ› Elsevier Science 🌐 English βš– 555 KB

We consider a thermoelastic problem for an elongated adhesively bonded assembly with identical nondeformable adherends and a `piecewise continuous' adhesive layer: the adhesive layer consists of a large number of `pieces' that dier by their lengths, Young's moduli, Poisson's ratios, and coecients of