Interfacial thermal stresses in a bi-material assembly with a low-yield-stress bonding layer

✍ Scribed by Suhir, E

• Book ID: 111864449
• Publisher: Institute of Physics
• Year: 2006
• Tongue: English
• Weight: 189 KB
• Volume: 14
• Category: Article
• ISSN: 0965-0393
• DOI: 10.1088/0965-0393/14/8/009