𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Thermal stresses analysis in adhesive/solder bonded bimaterial assemblies

✍ Scribed by Wang, Jialai; Zeng, Shixin

Book ID
118744517
Publisher
American Institute of Physics
Year
2008
Tongue
English
Weight
771 KB
Volume
104
Category
Article
ISSN
0021-8979

No coin nor oath required. For personal study only.

πŸ“œ SIMILAR VOLUMES

Adhesively bonded assemblies with identi
Adhesively bonded assemblies with identical nondeformable adherends and β€˜piecewise continuous’ adhesive layer: predicted thermal stresses in the adhesive
✍ E Suhir πŸ“‚ Article πŸ“… 2000 πŸ› Elsevier Science 🌐 English βš– 555 KB

We consider a thermoelastic problem for an elongated adhesively bonded assembly with identical nondeformable adherends and a `piecewise continuous' adhesive layer: the adhesive layer consists of a large number of `pieces' that dier by their lengths, Young's moduli, Poisson's ratios, and coecients of