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Stresses in a bonded wafer

✍ Scribed by Vincent J. Parks

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Shrinkage stresses in bonded plexiglas s

✍ V. D. Malyanov; A. A. Nasedkina; A. A. Vainshtein; S. D. Volkov 📂 Article 📅 1972 🏛 Springer US 🌐 English ⚖ 375 KB

Charge trapping in wafer bonded MOS stru

✍ Anders Jauhiainen; Stefan Bengtsson; Olof Engström 📂 Article 📅 1992 🏛 Elsevier Science 🌐 English ⚖ 259 KB

Thermal Residual Stresses in Bonded Repa

✍ D. R. Daverschot; A. Vlot; H. J. M. Woerden 📂 Article 📅 2002 🏛 Springer Netherlands 🌐 English ⚖ 213 KB

Modeling of Thermally Induced Stresses i

✍ Jing Zhang 📂 Article 📅 2011 🏛 Springer US 🌐 English ⚖ 425 KB

High yield in wafer bonding with surface

✍ W. Kissinger; G. Kissinger; J. Krüger; H. Hofmann 📂 Article 📅 1991 🏛 Elsevier Science 🌐 English ⚖ 336 KB

Interface layer effect on the stress dis

✍ Yin Zhang 📂 Article 📅 2007 🏛 Springer 🌐 English ⚖ 437 KB