Stresses and Dislocation Formation in Thin Films
β Scribed by Aleksandrov, L. N. ;Mitlina, L. A. ;Kostilov, V. N. ;Yankovskaya, T. V.
- Publisher
- John Wiley and Sons
- Year
- 1994
- Tongue
- English
- Weight
- 555 KB
- Volume
- 145
- Category
- Article
- ISSN
- 0031-8965
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π SIMILAR VOLUMES
The mechanical behavior of thin films and interconnect lines is investigated. Firstly, theoretical models of thermal stress evolution in thin films and passivated or unpassivated lines are considered. Secondly, the effect of texture in a copper thin film with a columnar grain structure is studied fr
An elastic and a viscoelastic analyses have been performed to determine the extent to which thin polymer films used in "k yper$ltration" process of desalination of bruckieh or sea water may be stressed. It was found that if pores of the size comparable to the thickness of the jZm exist in the rigid