Part II1: LTV and PLTV I Due to increasing market demands for GaAs substrates worldwide, improvements in physical characteristics such as warp, flatness, local thickness variation (LTV) and other parameters are required. III-Vs Review concludes its three-part series covering the round-robin testing
Stress analysis and bending tests for GaAs wafers
β Scribed by W. Dreyer; F. Duderstadt; S. Eichler; M. Jurisch
- Publisher
- Elsevier Science
- Year
- 2006
- Tongue
- English
- Weight
- 618 KB
- Volume
- 46
- Category
- Article
- ISSN
- 0026-2714
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