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Round-robin test for flatness measurement of GaAs wafers

Publisher
Elsevier Science
Year
1997
Tongue
English
Weight
418 KB
Volume
10
Category
Article
ISSN
0961-1290

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✦ Synopsis

Part II1: LTV and PLTV I Due to increasing market demands for GaAs substrates worldwide, improvements in physical characteristics such as warp, flatness, local thickness variation (LTV) and other parameters are required. III-Vs Review concludes its three-part series covering the round-robin testing of GaAs wafers by Japanese substrate suppliers. In this article we cover local thickness variation (LTV) and percentage local thickness variation (PLTV). Preceding articles covered warp and bow [1 ] and total thickness variation and total indicated reading [2].

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