Strengthening mechanism of SiC-particulate reinforced Sn–3.7Ag–0.9Zn lead-free solder

✍ Scribed by X. Wang; Y.C. Liu; C. Wei; H.X. Gao; P. Jiang; L.M. Yu

• Book ID: 116604778
• Publisher: Elsevier Science
• Year: 2009
• Tongue: English
• Weight: 855 KB
• Volume: 480
• Category: Article
• ISSN: 0925-8388
• DOI: 10.1016/j.jallcom.2009.02.002