In-plane Electronic Speckle Pattern Interferometry has been successfully used during tensile testing of semi-hard copper sheets in order to measure the strain rate. On one hand, heterogeneity in strain rate field has been found before the maximum of the tensile force (ε t 19.4 and 25.4%, respectivel
✦ LIBER ✦
Strain localization band width evolution by electronic speckle pattern interferometry strain rate measurement
✍ Scribed by Bruno Guelorget; Manuel François; Guillaume Montay
- Book ID
- 113897720
- Publisher
- Elsevier Science
- Year
- 2009
- Tongue
- English
- Weight
- 723 KB
- Volume
- 60
- Category
- Article
- ISSN
- 1359-6462
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