โ Scribed by B.C Peters; A.A Hendrickson; K.B Rundman
No coin nor oath required. For personal study only.
tzh (see+) FIG. 4. Logarithm of fractional change in Au, f, vs. @/a. Sensitivity of the stress measurement is +2 g/mm* and indicated in the figure.
respectively.
From the data of Corbett et aZ.,(+Q exp (Amok) was est~ated to be about 5.1. Together with Em1 = 0.12 eV, ('I D = 1.8 X 1O-1o cm2/sec was obtained. By taking A = 3.43 x lo-8 eVcm(i) and T = 77ยฐK p = 2.4 x 10s/om2 was obtained from the slope of the straight line in Fig. 4. Therefore, it appears reasonable to attribute the aging process to interstitial diffusion.
The authors are grateful to Prof. J. W. Kauffman for arranging usage of the Northwestern University, Materials Research Center, Van de Graeff accelerator and to Mr. R. Kloske for reading the manuscript.
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The effects of different solution methods on aging microstructure and properties of Cu-Cr-Sn-Zn alloy have been studied. The grain size of rapid solidification is much smaller than solid-solution grain size. Strengthening of smaller grain size is obvious. There are much more fine precipitates in the