SPIE Proceedings [SPIE SPIE's First International Symposium on Fluctuations and Noise - Santa Fe, NM (Sunday 1 June 2003)] Noise as a Tool for Studying Materials - Investigation of electromigration in copper interconnects by noise measurements

✍ Scribed by Emelianov, Vitali; Ganesan, Gopal; Puzic, Aleksandar; Schulz, Stefan; Eizenberg, Moshe; Habermeier, Hans-Ulrich; Stoll, Hermann; Weissman, Michael B.; Israeloff, Nathan E.; Kogan, A. Shulim

• Book ID: 121283743
• Publisher: SPIE
• Year: 2003
• Weight: 438 KB
• Volume: 5112
• Category: Article
• DOI: 10.1117/12.497014