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SPIE Proceedings [SPIE Microelectronic and MEMS Technologies - Edinburgh, United Kingdom (Wednesday 30 May 2001)] MEMS Design, Fabrication, Characterization, and Packaging - Modeling and simulation of a silicon microdiaphragm piezoresistive pressure sensor using finite element analysis (FEA) tools

✍ Scribed by Pang, A. J.; Desmulliez, Marc P.; Behringer, Uwe F. W.; Uttamchandani, Deepak G.

No coin nor oath required. For personal study only.

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