Spectroscopic characterization of the surface nanostructure of Ti during deposition on polycrystalline aluminium
β Scribed by Palacio, C.; Arranz, A.
- Publisher
- John Wiley and Sons
- Year
- 1999
- Tongue
- English
- Weight
- 199 KB
- Volume
- 27
- Category
- Article
- ISSN
- 0142-2421
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β¦ Synopsis
Auger electron spectroscopy (AES), x-ray photoelectron spectroscopy (XPS), angle-resolved x-ray photoelectron spectroscopy (ARXPS), ion scattering spectroscopy (ISS) and factor analysis (FA) have been used to study the deposition of titanium on polycrystalline aluminium at room temperature. Analysis of AES and XPS spectra suggests the formation of a titanium aluminide alloy during the first steps of deposition. Application of FA to the low-energy Auger electron spectra allows the identification of three principal factors that can be attributed to metallic aluminium, metallic titanium and titanium aluminide, respectively. The ARXPS measurements are consistent with a two-stage mechanism for titanium growth: a first stage characterized by the formation of a uniform layer ~4 ML thick of an intermetallic compound TiAl x (x = 1.5), followed by the formation of metallic titanium islands with an average thickness of 10 ML that grow over the TiAl x layer formed previously.
π SIMILAR VOLUMES
The underpotential deposition of copper on (100) and (111) palladium single crystals and polycrystalline substrates was investigated voltammetrically. Charge values indicate that the adsorption process leads to the formation ofa first monolayer which follows the substrateorientation. On the (100) pl