𝔖 Bobbio Scriptorium

✦ LIBER ✦

Some aspects of cost minimization of a thick film hybrid high-power device

✍ Scribed by Jan P. Kramek

Publisher: Elsevier Science
Year: 1978
Tongue: English
Weight: 455 KB
Volume: 18
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(78)90114-2

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Some aspects of placement optimization o

Some aspects of placement optimization of thermal significant components in thick film high-power hybrid integrated circuits

✍ Jan P. Kramek 📂 Article 📅 1983 🏛 Elsevier Science 🌐 English ⚖ 939 KB

Some aspects of placement optimization o

Some aspects of placement optimization of thermal significant components in thick film high-power hybrid integrated circuits : Jan P. Kramek. Microelectron. Reliab.23 (3), 421 (1983)

📂 Article 📅 1984 🏛 Elsevier Science 🌐 English ⚖ 126 KB

Synthesis and characterization of photop

Synthesis and characterization of photopatternable epoxy hybrid materials for the fabrication of thick and thermally stable microstructures with a high aspect ratio

✍ Kyung Ho Jung; Byeong-Soo Bae 📂 Article 📅 2008 🏛 John Wiley and Sons 🌐 English ⚖ 257 KB 👁 2 views

Hybrid techniques for computer circuits—

Hybrid techniques for computer circuits—II. The thick film aspects of a high thermal dissipation interconnection system for use with integrated circuits : K. C. Bingham and Y. Gurler IERE Conf. Hybrid Microelectron. Canterbury. 313 (25–27 Sept. 1973)

📂 Article 📅 1974 🏛 Elsevier Science 🌐 English ⚖ 121 KB

Some reliability aspects of electron bom

Some reliability aspects of electron bombarded semiconductor power devices : D. J. Bates, A. Silzars and A. Ballonoff. Solid State Tech. p. 31 (July 1974)

📂 Article 📅 1975 🏛 Elsevier Science 🌐 English ⚖ 135 KB

Solution of wire creep rupture problem i

Solution of wire creep rupture problem in a thick-film power hybrid : J. O. Honeycutt and E. W. Mace. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-9, 172 (1986)

📂 Article 📅 1987 🏛 Elsevier Science 🌐 English ⚖ 124 KB