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Some aspects of placement optimization of thermal significant components in thick film high-power hybrid integrated circuits

✍ Scribed by Jan P. Kramek

Publisher: Elsevier Science
Year: 1983
Tongue: English
Weight: 939 KB
Volume: 23
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(83)91167-8

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