Hybrid techniques for computer circuits—II. The thick film aspects of a high thermal dissipation interconnection system for use with integrated circuits : K. C. Bingham and Y. Gurler IERE Conf. Hybrid Microelectron. Canterbury. 313 (25–27 Sept. 1973)

• Publisher: Elsevier Science
• Year: 1974
• Tongue: English
• Weight: 121 KB
• Volume: 13
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(74)90242-x