Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part II: Modeling

✍ Scribed by K. L. Erickson; P. L. Hopkins; P.T Vianco

• Book ID: 112811922
• Publisher: Springer US
• Year: 1994
• Tongue: English
• Weight: 469 KB
• Volume: 23
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/bf02651366